Die sinter bonding in air using copper formate preform for formation of full-density bondline
نویسندگان
چکیده
منابع مشابه
A new approach for fabrication of bulk MMCs using Accumulative Channel-die Compression Bonding (ACCB)
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Optimum Designing of Forging Preform Die for the H-shaped Parts Using Backward Deformation Method and Neural Networks Algorithm
In a closed die forging process, it is impossible to form complex shapes in one stage, and thus it becomes necessary to use preform dies. In the present study, Backward Deformation Method and FE simulation via ABAQUS software has been used in order to design preform die of the H-shaped parts. In the Backward Deformation Method, the final shape of the part is considered as a starting point and u...
متن کاملOptimum Designing of Forging Preform Die for the H-shaped Parts Using Backward Deformation Method and Neural Networks Algorithm
In a closed die forging process, it is impossible to form complex shapes in one stage, and thus it becomes necessary to use preform dies. In the present study, Backward Deformation Method and FE simulation via ABAQUS software has been used in order to design preform die of the H-shaped parts. In the Backward Deformation Method, the final shape of the part is considered as a starting point and u...
متن کاملWire bonding using copper wire
Purpose – This paper attempts to review recent advances in wire bonding using copper wire. Design/methodology/approach – Dozens of journal and conference articles published recently are reviewed. Findings – The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strainhardening effects, and stiff wire on weak support struc...
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ژورنال
عنوان ژورنال: Transactions of Nonferrous Metals Society of China
سال: 2021
ISSN: 1003-6326
DOI: 10.1016/s1003-6326(21)65610-8